US Patent Issued to University of Alaska Anchorage on Aug. 25 for "Thermal insulation material from mycelium and forestry byproducts" (Alaska Inventors)

ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,716,049, issued on Aug. 25, was assigned to University of Alaska Anchorage (Anchorage, Alaska).

"Thermal insulation material from mycelium and forestry byproducts" was invented by Philippe Amstislavski (Anchorage, Alaska), Zhaohui Yang (Anchorage, Alaska) and Maria D. White (Anchorage, Alaska).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. Also disclosed are methods of making and using biodegradable insulation materials comprising a structural scaffold; and at least one temperature resilient fungus. For example, disclosed are ...