US Patent Issued to UNITED SILICON CARBIDE on June 9 for "Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking" (New Jersey Inventor)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,653,029, issued on June 9, was assigned to UNITED SILICON CARBIDE INC. (Scottsdale, Ariz.).

"Power block based on top-side cool surface-mount discrete devices with double-sided heat sinking" was invented by Ke Zhu (Princeton, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure relates to a cooling apparatus and a method for cooling semiconductor devices, wherein the cooling apparatus is disposed over a top surface and a bottom surface of a printed circuit board. The disclosed cooling apparatus comprises a printed circuit board, a first semiconductor device comprising a first thermal pad and mounted on a top surface of the printed circuit,...