US Patent Issued to United Semiconductor (Xiamen) on April 21 for "Reticle thermal expansion calibration method capable of improving sub-recipe" (Chinese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,607,584, issued on April 21, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Xiamen, China).

"Reticle thermal expansion calibration method capable of improving sub-recipe" was invented by Maohua Ren (Shamen City, China), Yuan-Chi Pai (Xiamen, China) and Wen Yi Tan (Xiamen, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A reticle thermal expansion calibration method includes exposing a first group of wafers and generating a first sub-recipe, performing data mining and data parsing to generate a plurality of overlay parameters, performing a linear regression on each of the overlay parameters, and generating a first coefficient of determinat...