ALEXANDRIA, Va., Sept. 17 -- United States Patent no. 12,417,985, issued on Sept. 16, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).
"Semiconductor device and method for fabricating the same" was invented by Meng-Ting Chiang (Taichung, Taiwan), Jen-Hsien Chang (Taichung, Taiwan) and Kai-Kuang Ho (Hsinchu, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a semiconductor substrate, a circuit structure and a ring-shaped protrusion. The semiconductor substrate has a front surface and a rear surface opposed to each other. The circuit structure is located on the front surface. The ring-shaped protrusion is protruded on the rear surface."
The patent was filed ...