US Patent Issued to United Microelectronics on March 24 for "Semiconductor structure comprising power deliver network structure" (Singaporean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,490, issued on March 24, was assigned to United Microelectronics Corp. (Hsinchu, Taiwan).

"Semiconductor structure comprising power deliver network structure" was invented by Zhi-Biao Zhou (Singapore) and Ding Lung Chen (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor including a substrate, a semiconductor element disposed on the substrate, an interconnect structure, first and second power deliver lines, and first and second power deliver network (PDN) structures. The interconnect structure is disposed in the element region, above the semiconductor element, and electrically connected with the semiconductor eleme...