US Patent Issued to UNITED MICROELECTRONICS on March 24 for "Semiconductor device and method for fabricating the same" (Singaporean Inventor)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,481, issued on March 24, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor device and method for fabricating the same" was invented by Mengkai Zhu (Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes: a substrate having a first semiconductor layer, an insulating layer, and a second semiconductor layer; an active device on the substrate; an interlayer dielectric (ILD) layer on the active device; a first contact plug in the ILD layer and electrically connected to the active device; and a second contact plug in the ILD layer and the insulating layer, wherein a top surface of the ...