US Patent Issued to UNITED MICROELECTRONICS on June 23 for "Semiconductor structure and fabricating method of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,681, issued on June 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan).

"Semiconductor structure and fabricating method of the same" was invented by Yi-Fan Li (Tainan City, Taiwan), Chen-Ming Wang (Kaohsiung City, Taiwan), Po-Ching Su (Tainan City, Taiwan), Pei-Hsun Kao (Kaohsiung City, Taiwan), Ti-Bin Chen (Tainan City, Taiwan), Chun-Wei Yu (Tainan City, Taiwan) and Chih-Chiang Wu (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor includes a substrate. A gate structure is disposed on the substrate. A liner oxide contacts a side of the gate structure. A silicon oxide spacer contacts the liner o...