US Patent Issued to UNITED MICROELECTRONICS on July 14 for "Semiconductor process prediction method and semiconductor process prediction apparatus considering overall features and local features" (Taiwanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,682,228, issued on July 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Semiconductor process prediction method and semiconductor process prediction apparatus considering overall features and local features" was invented by Hsin-Ming Hou (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor process prediction method and a semiconductor process prediction apparatus considering overall features and local features are provided. The semiconductor manufacturing process prediction method includes the following steps. Several equipment sensing curves are obtained. The equipment sensing curves are filtered to ...