ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,309, issued on Feb. 17, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).
"Semiconductor package structure" was invented by Purakh Raj Verma (Singapore), Ching-Yang Wen (Singapore) and Xingxing Chen (Singapore).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first wafer having a deep trench capacitor and a second wafer bonded to the first wafer, in which the second wafer includes a first active device on a first silicon-on-insulator (SOI) substrate and a first metal interconnection connected to the first active device and the deep trench capacitor. The first wafer further includes the deep trench capac...