US Patent Issued to UNITED MICROELECTRONICS on Feb. 17 for "Method for fabricating an interconnect structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,632, issued on Feb. 17, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Method for fabricating an interconnect structure" was invented by Shih-Cheng Chen (Tainan, Taiwan), Ko-Wei Lin (Taichung, Taiwan), Ying-Wei Yen (Miaoli County, Taiwan), Chun-Ling Lin (Tainan, Taiwan) and Po-Jen Chuang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for fabricating an interconnect structure is disclosed. A substrate with a first dielectric layer is provided. A first conductor is formed in the first dielectric layer. A second dielectric layer is formed on the first dielectric layer. A trench is formed in the second die...