US Patent Issued to UNITED MICROELECTRONICS on Dec. 23 for "Interconnection structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,067, issued on Dec. 23, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu, Taiwan).

"Interconnection structure" was invented by Min-Shiang Hsu (Kaohsiung, Taiwan), Yu-Han Tsai (Kaohsiung, Taiwan) and Chih-Sheng Chang (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An interconnection structure includes a first interconnection level, a second interconnection level, a third interconnection level, and a super via structure. The second interconnection level is disposed on the first interconnection level, and the third interconnection level is disposed on the second interconnection level. The second interconnection level includes a se...