US Patent Issued to UNITED MICROELECTRONICS on April 14 for "Matching method for semiconductor topography measurement and processing device using the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,756, issued on April 14, was assigned to UNITED MICROELECTRONICS CORP. (Hsinchu, Taiwan).

"Matching method for semiconductor topography measurement and processing device using the same" was invented by Po-Jen Hsiao (New Taipei City, Taiwan), Ya-Ching Cheng (Hsinchu City, Taiwan), Chih-Yueh Li (Taipei City, Taiwan), Yu-Ying Hu (Tainan City, Taiwan), Da-Ching Liao (Taichung City, Taiwan) and Zih-Wun Peng (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A matching method for semiconductor topography measurement and a processing device using the same are provided. The matching method includes the following steps. An original surface ...