US Patent Issued to Uniseal on Feb. 3 for "Two-component moisture curable thermal interface material for thermal management systems" (Indiana Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,540,216, issued on Feb. 3, was assigned to Uniseal Inc. (Evansville, Ind.).

"Two-component moisture curable thermal interface material for thermal management systems" was invented by Thanikaivelan Tindivanam Veeraraghavan (Newburgh, Ind.), Karthikeyan Sengotaiyan (Newburgh, Ind.) and Senthilkumar Veeraraghavan (Newburgh, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A two-part curable composition which cures to form a thermally conductive cured product, including: (a) a first part including: (1) at least one metal catalytic component for catalyzing the cure reaction; (2) a non-reactive diluent component; (3) a wetting agent component; (4) a filler ...