US Patent Issued to Unimicron Technology on Sept. 9 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,412,879, issued on Sept. 9, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Package structure and manufacturing method thereof" was invented by John Hon-Shing Lau (Taoyuan, Taiwan) and Tzyy-Jang Tseng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a circuit board, a package substrate, an electronic/photonic assembly, a film redistribution layer, a heat dissipation assembly, and an optical fiber assembly. The package substrate is disposed on the circuit board and electrically connected to the circuit board. The electronic/photonic assembly includes an ASIC assembly, an EIC assembly, and a PIC ...