US Patent Issued to Unimicron Technology on Sept. 9 for "Manufacturing method of package structure" (Taiwanese, Chinese Inventors)

ALEXANDRIA, Va., Sept. 10 -- United States Patent no. 12,414,243, issued on Sept. 9, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Manufacturing method of package structure" was invented by Kai-Ming Yang (Hsinchu County, Taiwan), Chen-Hao Lin (Keelung, Taiwan), Cheng-Ta Ko (Taipei, Taiwan), John Hon-Shing Lau (New Territories, Hong Kong), Yu-Hua Chen (Hsinchu, Taiwan) and Tzyy-Jang Tseng (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of manufacturing package structure includes following steps. An insulating composite layer is formed on a metal layer of a carrier board. A chip packaging module including a sealant and a first chip embedded therein is disposed on the i...