US Patent Issued to UNIMICRON TECHNOLOGY on Sept. 15 for "Collapse-free circuit structure with low capacitance effect" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,739,969, issued on Sept. 15, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan City, Taiwan).

"Collapse-free circuit structure with low capacitance effect" was invented by Chia-Yu Peng (Taoyuan City, Taiwan), Kai-Ming Yang (Taoyuan City, Taiwan), Pu-Ju Lin (Taoyuan City, Taiwan) and Cheng-Ta Ko (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A collapse-free circuit structure with low capacitance effect includes a circuit layer that is layered between a connection layer and a bottom circuit layer. A pad and an upper circuit of the connection layer are spaced with an upper gap for electrical insulation. The bottom circuit layer inc...