US Patent Issued to Unimicron Technology on May 12 for "Package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,330, issued on May 12, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan).

"Package structure and manufacturing method thereof" was invented by John Hon-Shing Lau (Taoyuan City, Taiwan) and Tzyy-Jang Tseng (Taoyuan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure includes a package substrate, an application specific integrated circuit (ASIC), a plurality of optoelectronic assemblies, and a plurality of organic interposers. The ASIC is disposed on the package substrate and electrically connected to the package substrate. The optoelectronic assemblies are separately disposed on the package substrate and sur...