US Patent Issued to UNIMICRON TECHNOLOGY on June 3 for "Circuit board assembly and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,100, issued on June 3, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Circuit board assembly and manufacturing method thereof" was invented by Yu-Shen Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "This disclosure provides a circuit board assembly and a manufacturing method thereof. The circuit board assembly includes circuit board, embedded chip, heat dissipation assembly and temperature switch structure. The temperature switch structure includes a first metal layer and a second metal layer stacked on each other. The first metal layer of the temperature switch structure is electrically connected to the circuit b...