US Patent Issued to Unimicron Technology on June 2 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., June 2 -- United States Patent no. 12,645,041, issued on June 2, was assigned to Unimicron Technology Corp. (Taoyuan City, Taiwan).

"Package structure" was invented by John Hon-Shing Lau (Taoyuan, Taiwan), Pu-Ju Lin (Hsinchu, Taiwan), Kai-Ming Yang (Hsinchu County, Taiwan), Chen-Hao Lin (Keelung, Taiwan), Cheng-Ta Ko (Taipei, Taiwan) and Tzyy-Jang Tseng (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a package structure including a circuit board, a co-packaged optics (CPO) substrate, an application specific integrated circuit (ASIC) assembly, a glass interposer, an electronic integrated circuit (EIC) assembly, a photonic integrated circuit (PIC) assembly, and an ...