US Patent Issued to Unimicron Technology on Feb. 17 for "Electronic package structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,711, issued on Feb. 17, was assigned to Unimicron Technology Corp. (Taoyuan, Taiwan).

"Electronic package structure and manufacturing method thereof" was invented by Chin-Sheng Wang (Taoyuan, Taiwan), Ra-Min Tain (Hsinchu County, Taiwan), Wen-Yu Lin (Taichung, Taiwan), Tse-Wei Wang (Hsinchu, Taiwan), Jun-Ho Chen (Taoyuan, Taiwan) and Guang-Hwa Ma (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package structure and manufacturing method thereof. The electronic package structure includes a circuit board, an interposer, a chip, a circuit structure, and a coaxial conductive element. The interposer is disposed on the circuit...