US Patent Issued to UNIMICRON TECHNOLOGY on Feb. 17 for "Circuit board structure and fabrication method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,219, issued on Feb. 17, was assigned to UNIMICRON TECHNOLOGY CORP. (Taoyuan, Taiwan).

"Circuit board structure and fabrication method thereof" was invented by Chun Hung Kuo (Taoyuan, Taiwan), Kuo-Ching Chen (Taoyuan, Taiwan), Yu-Cheng Huang (Taoyuan, Taiwan) and Yu-Hua Chen (Taoyuan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A circuit board structure includes a core, a wiring layer and a buried passive component. The wiring layer and the buried passive component are disposed on the core, and the buried passive component is electrically connected to the wiring layer. The buried passive component includes a first spiral metal layer, a seco...