ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,281, issued on May 12, was assigned to Ulrich Rotte Anlagenbau und Foerdertechnik GmbH (Salzkotten, Germany).
"Method for producing multi-layer circuit boards" was invented by Ulrich Rotte (Salzkotten, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A method for producing multi-layer circuit boards, wherein, in an assembly method step, multiple functional layers and at least one insulating layer of a circuit board to be produced are arranged in layers between a tool lower part and a tool upper part of a multi-part tool. At least one measuring transducer is positioned between the tool upper part and the tool lower part such that the measuring t...