US Patent Issued to UBE on Sept. 1 for "Polyimide film, high-frequency circuit substrate, and flexible electronic device substrate" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,723,132, issued on Sept. 1, was assigned to UBE Corp. (Ube, Japan).

"Polyimide film, high-frequency circuit substrate, and flexible electronic device substrate" was invented by Kosuke Yamaji (Ube, Japan), Keisuke Morimoto (Ube, Japan) and Norio Miura (Ube, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polyimide film including a polyimide prepared by reacting a tetracarboxylic acid component with a diamine component containing 4,4"-diamino-p-terphenyl, wherein the polyimide film has a glass transition temperature of higher than 290deg C., and has a coefficient of linear expansion in the temperature range of 50deg C. to 200deg C. of 10 ppm/K or l...