ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,773, issued on March 24, was assigned to Tyco Electronics (Shanghai) Co. Ltd. (Shanghai) and TE Connectivity Solutions GmbH (Schaffhausen, Switzerland).
"Sensor module" was invented by Weifeng Bian (Shanghai), Lei Pan (Shanghai), Jiang Wang (Shanghai), Yongyao Cai (Schaffhausen, Switzerland), Stephen Descioli (Schaffhausen, Switzerland), Richard T. Shell (Schaffhausen, Switzerland) and Nicholas Langston (Schaffhausen, Switzerland).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor module comprises a housing and a liquid level sensing module. The housing includes a first passage adapted to permit liquid to flow into an interior of the housing. T...