US Patent Issued to Tsinghua University on Sept. 8 for "Non-destructive in-situ measurement device and method for high-complexity structures based on Raman analysis" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,730,074, issued on Sept. 8, was assigned to Tsinghua University (Beijing).

"Non-destructive in-situ measurement device and method for high-complexity structures based on Raman analysis" was invented by Chen Wang (Beijing), Simian Zhang (Beijing), Yuqi Wang (Beijing), Xiaonan Deng (Beijing), Yifei Wu (Beijing) and Zhengcao Li (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure relates to a non-destructive in-situ measurement device and method based on Raman analysis. The device comprises: a laser light source that emits a laser beam; a focusing component that focuses the laser beam above a movable sample stage, with the focal p...