US Patent Issued to Tsinghua University on Aug. 4 for "3D structured inorganic nanoscale product and printing method and application thereof" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,698,572, issued on Aug. 4, was assigned to Tsinghua University (Beijing City, China).

"3D structured inorganic nanoscale product and printing method and application thereof" was invented by Hao Zhang (Beijing City, China), Jinghong Li (Beijing City, China), Hongbo Sun (Beijing City, China), Linhan Lin (Beijing City, China), Fu Li (Beijing City, China), Shaofeng Liu (Beijing City, China), Wangyu Liu (Beijing City, China) and Zhengwei Hou (Beijing City, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a 3D structured inorganic nanoscale product and a printing method and application thereof. The printing method includes t...