ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,343, issued on Oct. 20, was assigned to Tsinghua University (Beijing) and HON HAI PRECISION INDUSTRY Co. LTD. (New Taipei, Taiwan).

"Graphene heating chip and method for making the same" was invented by Liang Liang (Beijing), Jie Zhao (Beijing), Yang Wei (Beijing), Qun-Qing Li (Beijing) and Shou-Shan Fan (Beijing).

According to the abstract* released by the U.S. Patent & Trademark Office: "A graphene heating chip includes a substrate, an insulating layer, a graphene film, and a plurality of electrodes. The substrate has two opposite a first surface and a second surface, and the substrate defines a through hole. The insulating layer is suspended on the substrate. The insulating la...