US Patent Issued to TSE on March 24 for "Test apparatus for semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,584,960, issued on March 24, was assigned to TSE Co. LTD. (Chungcheongnam-do, South Korea).

"Test apparatus for semiconductor package" was invented by Min Cheol Kim (Cheonan-si, South Korea), Sol Lee (Cheonan-si, South Korea) and Hyeon Gyeong Yang (Cheonan-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elas...