US Patent Issued to TSE on April 7 for "Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same" (South Korean Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,598,707, issued on April 7, was assigned to TSE Co. LTD. (Cheonan-si, South Korea).

"Method of manufacturing multi-layer circuit board including extreme fine via and multi-layer circuit board manufactured by the same" was invented by Byeong Yong Lee (Chungcheongnam-do, South Korea), Eun Ha Park (Chungcheongnam-do, South Korea), Weon Bin Jang (Chungcheongnam-do, South Korea), Gun Won Seo (Chungcheongnam-do, South Korea), Kum Sun Park (Chungcheongnam-do, South Korea) and Chung Hyeon Kim (Chungcheongnam-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a multi-layer circuit board including an extreme fine that may in...