US Patent Issued to TRANSOUND ELECTRONICS on May 26 for "Voice coil structure, method for manufacturing the same, and loudspeaker" (Taiwanese Inventors)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,641,373, issued on May 26, was assigned to TRANSOUND ELECTRONICS Co. LTD. (New Taipei, Taiwan).

"Voice coil structure, method for manufacturing the same, and loudspeaker" was invented by Tseng-Feng Wen (New Taipei, Taiwan), Chien-Kai Wen (New Taipei, Taiwan), Chun-Han Huang (New Taipei, Taiwan) and Chung-Hsien Tseng (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a voice coil structure, a method for manufacturing the voice coil structure, and a loudspeaker. The voice coil structure includes a first insulation layer, a first wiring layer, a second insulation layer, at least one second wiring layer, and a ...