US Patent Issued to TPI Technology on Dec. 30 for "In-mold sealing system to assist with vacuum assisted resin transfer molding" (Massachusetts, Rhode Island Inventors)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,743, issued on Dec. 30, was assigned to TPI Technology Inc. (Scottsdale, Ariz.).

"In-mold sealing system to assist with vacuum assisted resin transfer molding" was invented by Amirhossein Salimi (Providence, R.I.) and Alexander Segala (Rehoboth, Mass.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An in-mold sealing system for sealing openings in a wind turbine blade mold, the system including a wind turbine blade mold having an interior surface configured to form a surface of the wind turbine blade, the interior surface of the mold having at least one opening therein, at least one boss disposed within the at least one opening of the mold, the boss ...