ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,842, issued on March 3, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas).

"Highly integrated power electronics and methods of manufacturing the same" was invented by Feng Zhou (Ann Arbor, Mich.), Tianzhu Fan (Houston) and Ercan Mehmet Dede (Ann Arbor, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for high volume manufacture of highly integrated power electronics embedded printed circuit board (PCB)-cold plate assemblies or units includes assembling an integrated power electronics embedded PCB fabrication panel onto a cold plate fabrication panel and forming an integrated power electronics emb...