US Patent Issued to Toyota Motor Engineering & Manufacturing North America on March 17 for "Highly integrated power electronics and methods of manufacturing the same" (Michigan, Texas Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,960, issued on March 17, was assigned to Toyota Motor Engineering & Manufacturing North America Inc. (Plano, Texas).

"Highly integrated power electronics and methods of manufacturing the same" was invented by Feng Zhou (Ann Arbor, Mich.), Tianzhu Fan (Houston) and Jae Seung Lee (Ann Arbor, Mich.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a power device fabrication panel includes aligning a first alignment mark in a lead frame of a power device substrate array with a second alignment mark in a bonding fixture. The power device substrate array includes a plurality of power device pockets, the bonding fixture includes a ...