US Patent Issued to TOYOBO MC on Aug. 4 for "Three-dimensional network structure and manufacturing method therefor" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,763, issued on Aug. 4, was assigned to TOYOBO MC Corp. (Osaka, Japan).

"Three-dimensional network structure and manufacturing method therefor" was invented by Fumika Kawano (Otsu, Japan), Teruyuki Taninaka (Otsu, Japan), Daisuke Sakura (Otsu, Japan) and Shinichi Kobuchi (Osaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "It is provided that: a three-dimensional network structure that exhibits excellent cushioning property and excellent compression recoverability after thermal compression at a usage environmental temperature; and a manufacturing method therefor. A three-dimensional network structure having a three-dimensional random loop-bond...