US Patent Issued to TOWA on March 3 for "Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded product" (Japanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,986, issued on March 3, was assigned to TOWA Corp. (Kyoto, Japan).

"Compression molding die, resin molding device, resin molding system, and method for manufacturing resin molded product" was invented by Yusuke Yoshida (Kyoto, Japan), Kunihiko Fujiwara (Kyoto, Japan) and Kosuke Hayashi (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A compression molding die includes a first mold and a second mold. The first mold includes a bottom surface member and a side surface member. A space is providable in the first mold by a step of at least one of an outer peripheral surface of the bottom surface member and an inner peripheral surface of the si...