US Patent Issued to Toto on Sept. 8 for "Composite structure and semiconductor manufacturing apparatus including composite structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,729,124, issued on Sept. 8, was assigned to Toto Ltd. (Fukuoka, Japan).

"Composite structure and semiconductor manufacturing apparatus including composite structure" was invented by Hiroaki Ashizawa (Kitakyushu, Japan), Ryoto Takizawa (Kitakyushu, Japan) and Yuki Sunaba (Kitakyushu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed is a composite structure having low-particle generation usable for a member for a semiconductor manufacturing apparatus and also the semiconductor manufacturing apparatus. The composite structure including a base material and a structure that is provided on the base material wherein the structure comprises Y2SiO5...