US Patent Issued to TOSOH on Sept. 15 for "Metal-Si based powder, method for producing same, metal-Si based sintered body, sputtering target, and metal-Si based thin film manufacturing method" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,577, issued on Sept. 15, was assigned to TOSOH Corp. (Shunan, Japan).

"Metal-Si based powder, method for producing same, metal-Si based sintered body, sputtering target, and metal-Si based thin film manufacturing method" was invented by Hiroyuki Hara (Ayase, Japan) and Masami Mesuda (Ayase, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A metal-Si based powder contains a metal-Si based particle including a plurality of crystal phase grains. The crystal phase grains include a crystal phase containing a compound of a metal and Si. The crystal phase grains have an average grain size of, for example, 20 micro metre or less. The metal-Si based par...