US Patent Issued to Toshiba Tec on Dec. 16 for "Heating device with a heat conductor including portions having different thicknesses" (Japanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,498,658, issued on Dec. 16, was assigned to Toshiba Tec K.K. (Tokyo).

"Heating device with a heat conductor including portions having different thicknesses" was invented by Kazuhiko Kikuchi (Yokohama Kanagawa, Japan), Sasuke Endo (Chigasaki Kanagawa, Japan), Masaya Tanaka (Sunto Shizuoka, Japan), Ryota Saeki (Sunto Shizuoka, Japan), Kiyotaka Murakami (Mishima Shizuoka, Japan), Kousei Miyashita (Sunto Shizuoka, Japan), Ryosuke Kojima (Sunto Shizuoka, Japan), Yohei Doi (Mishima Shizuoka, Japan), Yuki Kawashima (Tagata Shizuoka, Japan) and Eiji Shinohara (Mishima Shizuoka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heating device includes a rot...