US Patent Issued to TORAY INDUSTRIES on Feb. 10 for "Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,545,784, issued on Feb. 10, was assigned to TORAY INDUSTRIES Inc. (Tokyo).

"Resin composition, resin composition film, cured film, hollow structure using same, and semiconductor device" was invented by Kazuyuki Matsumura (Otsu, Japan), Yoshiko Tateoka (Otsu, Japan) and Akira Shimada (Otsu, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In order to provide a resin composition excellent in pattern processability and film strength, a resin composition film, and a semiconductor device using these, there is provided a resin composition including (A) a polymer compound, (B) a cationic polymerizable compound, and (C) a cationic polymerization initiator, ...