US Patent Issued to Toray Advanced Materials Korea on June 3 for "Copper clad laminate film and electronic device including same" (South Korean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,324,094, issued on June 3, was assigned to Toray Advanced Materials Korea Inc. (Gyeongsangbuk-do, South Korea).

"Copper clad laminate film and electronic device including same" was invented by Jong Hun Cheon (Gyeongsangbuk-do, South Korea), Ha Soo Lee (Gyeongsangbuk-do, South Korea) and Jong Yong Park (Gyeongsangbuk-do, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Disclosed are a copper-clad laminate film and an electronic device including the same. The copper-clad laminate film includes a fluorine-containing substrate, a tie layer disposed on the fluorine-containing substrate, and a copper layer disposed on the tie layer, wherein the tie l...