US Patent Issued to TOPPAN on Nov. 3 for "Multilayer wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,182, issued on Nov. 3, was assigned to TOPPAN INC. (Tokyo).

"Multilayer wiring board" was invented by Akihiro Hayashi (Tokyo), Masahito Tanabe (Tokyo) and Tetsuyuki Tsuchida (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A multilayer wiring board includes two or more layers laminated together, each layer includes an insulating resin layer having a first surface and a second surface, and a conductor layer. The insulating resin layer includes a first recess that is open to the first surface, a groove section that is open to the first surface, and a second recess that is open to the second surface and communicates with one or more of the first re...