US Patent Issued to TOPPAN on July 14 for "Method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,685,183, issued on July 14, was assigned to TOPPAN INC. (Tokyo).

"Method for manufacturing wiring board" was invented by Yuki Umemura (Tokyo), Takehisa Takada (Tokyo) and Tomoyuki Ishii (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a wiring board, including a step A of forming a laser-modified portion in a glass substrate by applying laser light to the glass substrate from a first surface to an opposite surface of the glass substrate; a step B of forming a first surface wiring layer including a MIM capacitor on the first surface of the glass substrate; a step C of performing an etching process on a surface of the glass...