ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,676, issued on Feb. 24, was assigned to TOPPAN INC. (Tokyo).
"Composite wiring board" was invented by Masashi Sawadaishi (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board that facilitates narrowing a pitch of bonding terminals used for bonding to a semiconductor chip, providing finer wiring in a substrate and reducing cost, and is capable of achieving high connection reliability. A composite wiring board includes: a first wiring board; a second wiring board facing the first wiring board and bonded to the first wiring board, a distance from the second wiring board to the first wiring board being greater at a peripheral part than at...