US Patent Issued to TOP RANK TECHNOLOGY on Sept. 1 for "Liquid cooling heat dissipation system" (Samoan Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,115, issued on Sept. 1, was assigned to TOP RANK TECHNOLOGY Ltd. (Apia, Samoa).

"Liquid cooling heat dissipation system" was invented by Tien-Lai Wang (Apia, Samoa), Tzu-Yu Wang (Apia, Samoa), Cheng-Yu Wang (Apia, Samoa) and Meng-Yu Lee (Apia, Samoa).

According to the abstract* released by the U.S. Patent & Trademark Office: "A liquid-cooling heat dissipation system includes: a liquid-cooling vapor chamber, a liquid-cooling heat dissipation plate, a first and a second coolant pipelines connecting the two, a coolant circulation machine, a fan, and a cooling liquid. The liquid-cooling vapor chamber includes a liquid-cooling cover, a metallic top cover, and a metallic bottom cover. ...