US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Feb. 10 for "Sensor package structure and sensing module thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,463, issued on Feb. 10, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Sensor package structure and sensing module thereof" was invented by Chien-Hung Lin (Taipei, Taiwan), Jyun-Huei Jiang (Taipei, Taiwan), Wen-Fu Yu (Taipei, Taiwan), Wei-Li Wang (Taipei, Taiwan) and Bae-Yinn Hwang (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped supporting layer disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped supporting layer. The ring-shaped supporting layer ...