ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,490,541, issued on Dec. 2, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).
"Sensor package structure" was invented by Chien-Chen Lee (Hsin-Chu County, Taiwan), Li-Chun Hung (Hsin-Chu County, Taiwan) and Chia-Shuai Chang (Hsin-Chu County, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a light-permeable layer, a supporting layer having a ring-shape and being sandwiched between the sensor chip and the light-permeable layer, and an encapsulant that is formed on the substrate. The supporting layer...