US Patent Issued to TONG HSING ELECTRONIC INDUSTRIES on Dec. 16 for "Chip package structure and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,500,092, issued on Dec. 16, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).

"Chip package structure and method for fabricating the same" was invented by Dei-Cheng Liu (Taipei, Taiwan), Chia-Shuai Chang (Hsin-Chu County, Taiwan), Ming-Yen Pan (Taipei, Taiwan), Jian-Yu Shih (Taipei, Taiwan), Jhih-Wei Lai (Taipei, Taiwan) and Shih-Han Wu (Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A chip packaging structure and a method for fabricating the same are provided. The chip package structure includes a conductive substrate, a dam and a metal shielding layer. The conductive substrate includes a substrate, vias and electro...