ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,734,555, issued on Sept. 15, was assigned to Tokyo Seimitsu Co. Ltd. (Tokyo).
"Cleaning device for wafer-suction chuck mechanism" was invented by Junichi Fukushima (Hachioji, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the fram...