US Patent Issued to TOKYO SEIMITSU on April 21 for "Laser machining device, wafer processing system, and method for controlling laser machining device" (Japanese Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,605,788, issued on April 21, was assigned to TOKYO SEIMITSU Co. LTD. (Tokyo).

"Laser machining device, wafer processing system, and method for controlling laser machining device" was invented by Chikara Aikawa (Tokyo) and Satoru Iwaki (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "The laser machining device includes an observation image acquiring unit configured to repeatedly acquire an observation image of a machining spot of laser light emitted from a laser optical system to a street on a wafer while a machined groove is being formed, a luminance detector configured to detect a luminance of a plasma generated at the machining spot by emission ...