US Patent Issued to TOKYO OHKA KOGYO on Oct. 6 for "Cleaning solution, method for cleaning substrate, and method for manufacturing semiconductor" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,753,366, issued on Oct. 6, was assigned to TOKYO OHKA KOGYO Co. LTD. (Kawasaki, Japan).

"Cleaning solution, method for cleaning substrate, and method for manufacturing semiconductor" was invented by Moe Nishijima (Kawasaki, Japan), Kohei Serizawa (Kawasaki, Japan) and Emi Uchida (Kawasaki, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning solution, a method for cleaning a substrate, and a method for manufacturing a semiconductor. The cleaning solution includes at least one of a compound a1 represented by a general formula (a1), a salt of the compound (a1), a hydrate of the compound (a1), hydrogen iodide, borane, and a complex of the borane;...